| Stage | Action | Target Temp | Ramp Rate | Duration | |-------|--------|-------------|-----------|----------| | 1 | Bottom Preheat (board dry-out) | 120°C | 1.5°C/sec | Hold 90 sec | | 2 | Bottom Soak | 180°C | 1.0°C/sec | Hold 60 sec | | 3 | Top + Bottom Ramp to Reflow | 235°C (top), 200°C (bottom) | 2.0°C/sec | Hold 20 sec | | 4 | Natural Cooling | 0°C (heaters off) | N/A | Until <50°C |
. This is essential for long, multi-step profiles needed for lead-free BGA rework. 3. Creating a Reflow Profile A standard profile consists of four main stages: achi ir6500 software
The primary function of the ACHI IR6500 software is to manage the : | Stage | Action | Target Temp |
Once the driver is active, you need the main application. The proprietary software for the ACHI IR6500 is often labeled as or something similar depending on the OEM version. This is the heart of the operation. Creating a Reflow Profile A standard profile consists
Some possible features of the Achi IR6500 software include:
ACHI IR6500 software is designed to provide precision control over the rework station's heating zones, allowing users to program, monitor, and save specific thermal profiles for delicate BGA soldering tasks. While essential for consistent results, the software has a reputation for being finicky with modern operating systems and sometimes difficult to configure initially. Key Software Features Profile Management
